NETZSCH - Leading Thermal Analysis.
   
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 INFORMATION REQUEST FORM

 

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The more information you provide, the better reply we can provide to help you find the best instrument or product that suits your testing needs and thermal analysis application.

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NETZSCH Instruments, Inc.
37 North Ave.
Burlington, MA 01803
Ph: 781-272-5353
Fax: 781-272-5225
Email: NIB-Sales@netzsch.com.
Contact Information

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I am interested in:  
Thermal Analysis Thermal Conductivity / Diffusivity
Cure Monitoring Contract Testing

Equipment Purchase within 3 months 12 months later

   
My field of work (in general) is:
Research / Development
Teaching
Quality Assurance / Production Control Other
   
I am interested in the following methods:
DSC TCT (Thermal Conductivity)

DEA Cure Monitoring / Dielectric Analysis
Please describe your material, production process, curing time, and temperature conditions:

LFA (Thermal Diffusivity by Laser Flash Method)

Refractories Testing (RUL / CIC, MOR)   
   

DTA

 
TGA (TG)  
STA (TGA-DSC / TGA-DTA)  
   
DMA  
TMA  
DILATOMETRY  

 
I am interested in the following instruments (as mostly described in the "Products" area):

DSC 204 F1 Phoenix®
DSC 200-F3 Maia®
DSC 204-HP (to 2000 psi)
DSC 404 F1 Pegasus®
DSC 404 F3 Pegasus®
DSC 404 C Pegasus®
DTA 404 PC Eos®

TG 209 F1 IRIS®
TG 209 F3 Tarsus®
STA 449 F1 Jupiter®
STA 449 F3 Jupiter®
STA 449 C Jupiter®
STA 409-PC Luxx®
STA 409 (to 2000°C)
TMA 202
DIL 402 C
DIL 402 CD - Dual & Differential
DIL 402 PC
DMA 242

STA 409 C - QMS Skimmer®
TG - QMS Capillary
TG - FTIR

Cure Monitoring Dielectric Analyzers

DEA 230
DEA 231
DEA 234 CurePak

Thermal Conductivity & Diffusivity Testing

Heat Flow Meter for Insulation Testing
TCT 426 (hot wire methods, high temperature)
LFA 427 Laser Flash
LFA 457 Microflash
LFA 447 Nanoflash

Refractories Testing

Glaze Stress Tester 420 PC RUL/CIC 421 Refractoriness Under Load
MOR 422 Modulus of Rupture

   
I am interested in the following Advanced Software:
Thermokinetics (multiple curves, multiple steps, process predictions) Purity Determination
Multicomponent Analysis
Thermal Simulations Rate controlled methods (Rate Controlled Sintering, Rate Controlled Mass change, high resolution TGA)
Peak Separation
   
The Materials of interest for me:

Polymers

Thermoplastics
Thermosets
Elastomers, Rubbers

Ceramics

Technical Ceramics
Porcelain (Tableware, Sanitary ware)
   

Composites
Wood / Textile / Cellulose
Pharmaceuticals
Food

Building Materials
Tiles
Glass
Minerals / Soil
Metals, Alloys
Carbon / Graphite
Please specify the description of your materials or if you are
working on other materials, please provide details:
   
The temperature limits for my tests are as follows:

Lower Temperature Limit:

-180°C

0°C

-120°C

+25°C

-100°C

+50°C

-40°C

+300°C

-20°C

 

Upper Temperature Limit:

200°C

1300°C

300°C

1400°C

350°C

1500°C

500°C

1650°C

1000°C

2000°C

1200°C

2400°C


Instrument specific temperature range (please describe):

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The instrument should have these capabilities:
vacuum tight (pure gas possibilities)

gas change capabilities
gas flow capabilities Cp-measurements
   
Other specifications / instrument needs:  
   
Please send me:
Order forms / information sheets for
     "NETZSCH Annuals for Science and Industry"
     and for "Focus on Thermal Analysis for Polymers"
Order forms / information sheets for the
      "Ceramic Handbook - TA for Ceramic Material"
Information about Application Seminars / Workshops
Information about Training Courses
the "Application Service" articles on the Advanced Software
the periodical NETZSCH Thermal Analysis Newsletter "Onset"
   
Additional comments:
   
         

 

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NETZSCH offers precision thermal analysis instruments including advanced dilatometers (with a new basic R&D/QC dilatometer), classical DSC & TGA (with a new economical DSC), high temperature DSC to 1650°C for specific heat, very high temperature STA (TGA-DSC/DTA) to 2400°C (featuring the new STA 409-PC Luxx®), thermal / evolved gas analysis with fully-integrated FTIR & MS, plus high resolution TMA and DMA. We also feature leading technology for thermal conductivity and diffusivity measurement as well as refractories testing including HMOR, CIC, and RUL.

Information Request Form
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Last update: 06/17/2008 , Copyright © 2000-2006 NETZSCH-Geraetebau GmbH